Dycure Series (Micro Dicyandiamide)

Dycure used at thermosetting epoxy resin system as latent curing agent, which is less than 1.6%of dispersant, in order to prevent the product caking and promote Dycure evenly dispersed in theepoxy resin system, widely used in one-component adhesive glue agent, composite materialsand powder coating.Also supply customized supply customized 10um, 8um, 6um, 4um, etc.